Conductive foam for EMI Shielding


Conductive Foam

Limitless Shieldings Conductive foam for EMI Shielding is truly an amazing product that offers exceptional EMI shielding performance. 

Designed as a low-density foam, it is plated throughout to offer low resistance electrical conductivity. Plus, this amazing foam is UL94V-1 flame retardant. With a little closure force, it easily compresses down to as little as 0.5mm, making it incredibly easy to use for a wide range of applications. 

While it doesn’t provide water sealing, its ability to effectively seal out dust is unmatched.

When it comes to materials that need to be cut and assembled in place, there are few options that offer the level of convenience and ease as these particular Conductive foam for EMI Shielding materials. They have been specially designed to require very minimal closure force, which means that fixings can be placed further apart than they can with other types of shielding materials. This not only makes assembly simpler and more efficient, but also reduces the time and effort required for installation and maintenance. 

While it is important to note that these Conductive foam for EMI Shielding materials may not offer full liquid protection, they are still highly effective at shielding against EMI and dust, which makes them perfect for many different applications. The PSA used in these materials is incredibly high bond, which means that additional fixings are rarely required. 

For optimal shielding effectiveness, we strongly recommend applying a compression of approximately 30%.

Applications for Conductive foam for EMI Shielding

  • Lining Computer and Telecommunications enclosures
  • Applications which require ESD control/grounding only
  • Connector and bespoke gaskets
  • Conductive pads or cushions
  • I/O connector panels


  • Our conductive foam is available as sheets 450 x 450mm square, as strips or as die cut gaskets to drawing.

  • It is available in 1.5, 2.5 and 3.5mm thick

  • It is available with or without conductive PSA.

Design Considerations

These materials are easily cut and assembled in place. The joints are not usually required to be bonded.

Very low closure force is required, so fixings can be fairly far apart compared to other shielding materials.

These materials offer little no liquid protection. Only EMI and dust protection.

The PSA used is very high bond. Extra fixings are very rarely required.

We recommend a compression of 30% for effective shielding.

For more information, please Contact Us